【51272153】碳纳米管互连的3D芯片硅通孔关键技术及可靠性研究国家自然基金项目

碳纳米管互连的3D芯片硅通孔关键技术及可靠性研究

项目批准号： 51272153

批准年份： 2012

学科分类： E0207.无机非金属半导体与信息功能材料

项目负责人：刘建影

资助类别：面上项目

负责人职称：教授

依托单位：上海大学

资助金额： 80万元

关键词：碳纳米管;硅通孔;化学气相沉积;可靠性;互连

起止时间： 2013-01-01到2016-12-31

中英文摘要
结题摘要
结题报告
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序号	标题	类型	作者
1	Experimental Study of Electrical Properties and Stability of CNT Bumps in High Density Interconnects	会议论文	Di Jiang\|Yifeng Fu\|Shi-wei Ma\|Johan Liu\|
2	A High Performance Ag Alloyed Nano-scale n-type Bi2Te3 Based Thermoelectric Material	期刊论文	Si Chen\|Nikolaos Logothetis\|Lilei Ye\|Johan Liu\|
3	Characterization for Graphene as Heat Spreader Using Thermal Imaging Method	会议论文	Ling Wang\|Yifeng Fu\|Yan Zhang\|Johan Liu\|
4	A Carbon Fiber Solder Matrix Composite for Thermal Management of Microelectronic Devices	期刊论文	Lilei Ye\|Valdas Jokubavicius\|Mikael Syvajarvi\|Johan Liu\|
5	Mechanical and Thermal Characterization of A Novel Nanocomposite Thermal Interface Material for Electronic Packaging	期刊论文	Xin Luo\|Yifeng Fu\|Lilei Ye\|Johan Liu\|
6	Embedded Fin-like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors	期刊论文	Andreas Nylander\|Yifeng Fu\|Kjell Jeppson\|Johan Liu\|
7	Thermal Chemical Vapor Deposition Grown Graphene Heat Spreader for Thermal Management of Hot Spots	期刊论文	Yong Zhang\|Yifeng Fu\|Matthew M.F. Yuen\|Johan Liu\|
8	Fabrication and Characterization of A Metal Matrix Polymer Fibre Composite for Thermal Interface Material Applications	会议论文	Carl Zandén\|Xin Luo\|Lilei Ye\|Johan Liu\|
9	Vertically Stacked Carbon Nanotube-based Interconnects for Through Silicon Via Application	期刊论文	Si Chen\|Yifeng Fu\|Kjell Jeppson\|Johan Liu\|
10	A New Solder Matrix Nano Polymer Composite for Thermal Management Applications	期刊论文	Carl Zanden\|Xin Luo\|Lilei Ye\|Johan Liu\|
11	Mechanical Properties of A Novel Nano-thermal Interface Material	会议论文	Carl Zanden\|Lilei Ye\|Xiuzhen lu\|Johan Liu\|
12	Novel Thermal Interface Materials: Boron Nitride Nanofiber and Indium Composites for Electronics Heat Dissipation Applications	期刊论文	Murali Murugesan\|Yu Cao\|Lilei Ye\|Johan Liu\|
13	Reliability of Carbon Nanotube Bumps for Chip on Glass Application	会议论文	Shirong Huang\|Yifeng Fu\|Yan Zhang\|Johan Liu\|
14	Thermal Properties of TIM using CNTs Forests in Electronic Packaging	会议论文	Ning Wang\|Shuangxi Sun\|Xiuzhen Lu\|Johan Liu\|
15	Tape-assisted Transfer of Carbon Nanotube Bundles for Through-silicon-via Applications	期刊论文	Michael Edwards\|Yong Zhang\|Kjell Jeppson\|Johan Liu\|
16	Combination of Positive Charges and Honeycomb Pores to Promote MC3T3-E1 Cell Behaviour	期刊论文	Joakim Sandstedt\|Yifeng Fu\|Anders Lindahl\|Johan Liu\|
17	Flexible Multifunctionalized Carbon Nanotubes-based Hybrid Nanowires	期刊论文	Murali Murugesan\|Michael Edwards\|Yifeng Fu\|Johan Liu\|
18	Reliability of Carbon Nanotube Bumps for Chip on Film Application	会议论文	Di Jiang\|Yifeng Fu\|Yan Zhang\|Johan Liu\|
19	Reliability of Graphene-based Films Used for High Power Electronics Packaging	会议论文	Ning Wang\|Yifeng Fu\|Lilei Ye\|Johan Liu\|
20	Carbon Nanotube/Solder Hybrid Structure for Interconnect Applications	会议论文	Shuangxi Sun\|Wei Mu\|Yifeng Fu\|Johan Liu\|
21	Thermal Characterization of Power Devices using Graphene-based Film	会议论文	Carl Zandén\|Lilei Ye\|Yifeng Fu\|Johan Liu\|
22	The Effect of Graphene-based Film as Heat Spreader on Thermal Management in Electronic Packaging	会议论文	Yifeng Fu\|Lilei Ye\|Kjell Jeppson\|Johan Liu\|
23	新型BN/Ag二维层状复合材料的导热胶的制备及其导热性能的表征	期刊论文	张燕\|路秀真\|叶丽蕾\|刘建影\|
24	Experimental Study on the Mechanical Reliability of Carbon Nanotubes	会议论文	Yan Zhang\|Ling Wang\|Jing-yu Fan\|Johan Liu\|
25	Synthesis and Applications of Two-dimensional Hexagonal Boron Nitride in Electronics Manufacturing	期刊论文	Yifeng Fu\|Lilei Ye\|Xiuzhen Lu\|Johan Liu\|
26	Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Bi2Te3 Nanoparticles	期刊论文	Di Jiang\|Lilei Ye\|Michael Edwards\|Johan Liu\|
27	Characterization of Nano-enhanced Interconnect Materials for Fine Pitch Assembly	期刊论文	Shiwei Ma\|Marek Koscielski\|Lilei Ye\|Johan Liu\|
28	Chemically Vapor Deposited Carbon Nanotubes for Vertical Electronics Interconnect in Packaging Applications	会议论文	Johan Liu\|Yifeng Fu\|Di Jiang\|
29	Controlling the Density of CNTs by Different Underlayer Materials in PECVD Growth	会议论文	Di Jiang\|Yifeng Fu\|Shantung Tu\|Johan Liu\|
30	Use of Graphene-based Films for Hot Spot Cooling	会议论文	Pengtu Zhang\|Nan Wang\|Yifeng Fu\|Johan Liu\|
31	Efficient Surface Modification of Carbon Nanotubes for Fabricating High Performance CNT Based Hybrid Nanostructures	期刊论文	Changhong Zhao\|Fredrik Westerlund\|Ivan Mijakovic\|Johan Liu\|
32	Development and Characterization of Graphene-enhanced Thermal Conductive Adhesives	会议论文	Paolo Ciambelli\|Nan Wang\|Lilei Ye\|Johan Liu\|
33	A Solder Joint Structure with Vertically Aligned Carbon Nanofibres as Reinforcements	会议论文	Si Chen\|Di Jiang\|Lilei Ye\|Johan Liu\|
34	Carbon Nanotubes for Electronics Manufacturing and Packaging : from Growth to Integration	期刊论文	Johan Liu\|Di Jiang\|Yifeng Fu\|Teng Wang\|
35	Study on the Verification of IR and RTD Methods Applied in the Thermal Measurement of High Power Chips	会议论文	Yong Zhang\|Yifeng Fu\|Jing-Yu Fan\|Johan Liu\|
36	Measurement of Dielectric Properties of Ultrafine BaTiO3 Using an Organic-Inorganic Composite Method	期刊论文	Jie Bao\|Weiwang Wang\|Shengtao Li\|Johan Liu\|
37	Vertically Aligned CNT-Cu Nano-composite Material for Stacked Through-silicon-via Interconnects	期刊论文	Luca Pierantoni\|Yifeng Fu\|Kjell Jeppson\|Johan Liu\|
38	Cooling Hot Spots by Hexagonal Boron Nitride Heat Spreaders	会议论文	Yifeng Fu\|Yong Zhang\|Lilei Ye\|Johan Liu\|
39	Enhanced Cold Wall CVD Reactor Growth of Horizontally Aligned Single-walled Carbon Nanotubes	期刊论文	Kjell Jeppson\|Kenneth Teo\|Goo-Hwan Jeong\|Johan Liu\|
40	The Promising Application of Graphene Oxide as Coating Materials in Orthopedic Implants: Preparation, Characterization and Cell Behavior	期刊论文	Changhong Zhao\|Xiuzhen Lu\|Carl Zanden\|Johan Liu\|
41	Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application	期刊论文	Michael Edwards\|Kjell Jeppson\|Sebastian Volz\|Johan Liu\|
42	A Brief Overview of Atomic Layer Deposition and Etching in the Semiconductor Processing	会议论文	Guangjie Yuan\|Ning Wang\|Shirong Huang\|Johan Liu\|
43	Characterization of Nano-enhanced Interconnect Materials for Fine Pitch Assembly	期刊论文	Shiwei Ma\|Marek Koscielski\|Lilei Ye\|Johan Liu\|

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