【U1034006】单晶SiC基片高效超精密磨粒加工技术基础研究国家自然基金项目

单晶SiC基片高效超精密磨粒加工技术基础研究

项目批准号： U1034006

批准年份： 2010

学科分类： E0511.机械测试理论与技术

项目负责人：徐西鹏

资助类别：联合基金项目

负责人职称：教授

依托单位：华侨大学

资助金额： 190万元

关键词：基片;高效磨削;磁流变;单晶碳化硅;抛光

起止时间： 2011-01-01到2014-12-31

中英文摘要
结题摘要
结题报告
项目成果
项目参与人

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序号	标题	类型	作者
1	Study on machining characteristics of sawing Al2O3 ceramic with diamond cut-off wheel	期刊论文	Zheng Fengbiao\|Chen Mei\|Shen Jianyun\|Guo Hua\|Xu Xipeng\|
2	石材高效加工用金刚石磨粒工具关键技术及应用	奖励	徐西鹏\|黄辉\|李远\|沈剑云\|黄国钦\|郭桦\|于怡青\|
3	Advanced nano-finishing process of SrTiO3 substrate by cluster MR-effect plate	期刊论文	Bai, Zhen Wei\|Yan, Qiu Sheng\|Lu, Jia Bin\|
4	Effect of abrasives on the lapping performance of 6H-SiC single crystal wafer	期刊论文	Li, Wei\|Yan, Qiu Sheng\|Lu, Jia Bin\|Pan, Ji Sheng\|
5	Study on fixed abrasive lapping hard and brittle materials with brazed micro powder diamond disk	期刊论文	Li, Quancheng\|Shen, Jianyun\|Fang, Congfu\|Xu, Xipeng\|
6	单晶SiC基片的集群磁流变平面抛光加工	期刊论文	潘继生\|阎秋生\|徐西鹏\|童和平\|祝江停\|白振伟\|
7	凝胶结合剂磨粒工具制备及其磨抛性能研究	期刊论文	徐西鹏\|刘娟\|于怡青\|陆静\|
8	磨料与工件对集群磁流变效应抛光垫磨粒“容没”效应的影响	期刊论文	白振伟\|周旭光\|阎秋生\|
9	基于弧区微段测力的锯切力与能量特征研究	奖励	黄国钦\|徐西鹏\|
10	细粒度金刚石钎焊热损伤的实验研究	期刊论文	尹芳\|黄辉\|徐西鹏\|
11	Abrasive Particles Trajectory Analysis and Simulation of Cluster Magnetorheological Effect Plane Polishing	期刊论文	Jisheng Pan\|Qiusheng Yan\|Xipeng Xu\|Jiangting Zhu\| Zhancheng Wu\|Zhenwei Bai\|
12	磁流变-化学机械复合抛光装置设计	期刊论文	祝江亭\|阎秋生\|高伟强\|
13	A study on planarization grinding process based on the cluster magnetorheological effect	期刊论文	J.W. Yan\|Q.S. Yan\|J.B. Lu\|L.Y. Kong\|Z.C. Wu\|
14	Experimental research on smooth surface polishing based on the cluster magnetorheological effect	期刊论文	Jie Wen Yan\|Qiu Sheng Yan\|Jia Bin Lu\|Wei Qiang Gao\|Zhi Ying Huang\|
15	Surface and subsurface damage characteristics and material removal mechanism in 6H-SiC wafer grinding	期刊论文	Yan Qiusheng\|Chen senkai\|Pan Jisheng\|Lu Jiabin\|Liu Qi\|
16	基于溶胶凝胶法的纳米磨料抛光工具基体特性研究(英文)	期刊论文	宋运运\|陆静\|徐西鹏\|
17	电磁流变效应微磨头加工电磁耦合协同作用机理实验研究	期刊论文	路家斌\|阎秋生\|潘继生\|高伟强\|
18	Microstructural Property of Silicon Thin Films Deposited on Nanodiamonds Related to QALD Growth Condition	期刊论文	Jing Lu\|Yan Hui Wang\|
19	Ultra smooth polishing research based on the cluster magnetorheological effect	期刊论文	Z.C. Wu\|Q.S. Yan\|Z.W. Bai\|L.Y. Kong\|J.F. Chai\|
20	凝胶结合剂磨粒工具制备及其磨抛性能研究	期刊论文	Xu, Xipeng\|Liu, Juan\|Yu, Yiqing\|Lu, Jing\|
21	Study on the machining parameters in polishing single-crystal SiC wafers with SG films	期刊论文	Du, Zhi\|Lu, Jing\|Fang, Congfu\|Huang, Hui\|Xu, Xipeng\|
22	集群磁流变效应抛光垫的磨粒“容没”效应机理研究	期刊论文	白振伟\|阎秋生\|路家斌\|徐西鹏\|
23	Study on compound machining of polyurethane polishing pad and cluster abrasive brush based on MR effect	期刊论文	M. Li\|Q.S. Yan\|J.B. Lu\|J.F. Chai\|
24	超薄钛酸锶基片研磨加工工艺优化	期刊论文	王威\|阎秋生\|潘继生等\|
25	单晶SiC基片的集群磁流变平面抛光加工	期刊论文	潘继生\|阎秋生\|徐西鹏\|童和平\|祝江停\|白振伟\|
26	Polishing Silicon Wafers with the Nanodiamond Abrasive Tools Prepared by Sol-Gel Technique	会议论文	Hu, Guangqiu\|Lu, Jing\|Xu, Xipeng\|
27	SrTiO3陶瓷基片集群磁流变研磨加工表面特性研究	期刊论文	刘俊龙阎秋生路家斌潘继生\|
28	Experimental study of surface performance of monocrystalline 6H-SiC substrates in plane grinding with a metal-bonded diamond wheel	期刊论文	Pan Jisheng\|Zhang Xiaowei\|Yan Qiusheng\|
29	氮化铝陶瓷基片的集群磁流变效应研磨加工	期刊论文	白振伟\|周旭光\|刘俊龙\|阎秋生\|
30	集群磁流变平面抛光加工技术	期刊论文	潘继生\|阎秋生\|路家斌\|徐西鹏\|陈森凯\|
31	The？effects？of？abrasive？yielding？in？polishing？of？SiC？wafers？with？semi-fixed？flexible？pad	期刊论文	Jing Lu\|Yang Li\|Xipeng Xu\|
32	Study of cluster magnetorheological-chemical mechanical polishing technology for the atomic scale ultra-smooth surface planarization of SiC	期刊论文	Zhu, Jiang Ting\|Lu, Jia Bin\|Pan, Ji Sheng\|Yan, Qiu Sheng\|Xu, Xi Peng\|
33	氮化铝基片的集群磁流变抛光加工	期刊论文	白振伟\|阎秋生\|路家斌\|潘继生\|祝江停\|
34	Analysis of path distribution in lapping and polishing with single fixed abrasive	期刊论文	Lu, Longyuan\|Fang, Congfu\|Shen, Jianyun\|Lu, Jing\|Xu, Xipeng\|
35	电磁流变效应微磨头抛光加工电磁协同作用机理	奖励	路家斌\|阎秋生\|高伟强\|
36	磁流变-化学机械复合抛光装置设计	期刊论文	祝江停\|阎秋生\|高伟强\|
37	电磁流变效应微磨头加工电磁耦合协同作用机理实验	期刊论文	路家斌\|阎秋生\|潘继生\|高伟强\|
38	Influence of abrasive on planarization grinding based on the cluster magnetorheological effect	期刊论文	Qiusheng Yan\|Jiewen Yan\|Jiabin Lu\|Weiqiang Gao\|Min Li\|
39	Surface Characterization of Silicon Wafers Polished by Three Different Methods	期刊论文	G.Q. Hu\|Jing Lu\|Jian Yun Shen\|Xi Peng Xu\|
40	单面研磨6H-SiC晶片的加工表面性能分析	期刊论文	潘继生\|阎秋生\|李伟\|
41	Parametric investigation into accommode-sinking effect of cluster magnetorthelogical effect pad	期刊论文	Zhenwei Bai\|Qiusheng Yan\|Jianbin Lu\|Xipeng Xu\|
42	一种电磁式集群磁流变电磁铁的结构设计与优化	期刊论文	童和平\|阎秋生\|潘继生\|
43	Experimental research on smooth surface polishing based on the cluster magnetorheological effect	期刊论文	Jiewen Yan\|Qiusheng Yan\|Jiabin Lu\|Weiqiang Gao \|
44	SrTiO3陶瓷集群磁流变研磨加工表面特性研究	期刊论文	刘俊龙\|阎秋生\|路家斌\|潘继生\|李伟\|
45	单颗金刚石磨粒磨削SiC的磨削力实验研究	期刊论文	贺勇\|黄辉\|徐西鹏\|
46	Vertical Spindle Grinding of Si and Granite with a New Abrasive Disk	期刊论文	Y Yu\|J Liu\|B Kuang\|J Shen\|X Xu\|
47	凝胶结合剂超细金刚石磨粒工具的制备及应用	期刊论文	陆静\|罗求发\|徐西鹏\|
48	一种电磁式集群磁流变电磁铁的结构设计及优化	期刊论文	童和平\|阎秋生\|潘继生\|
49	Effect of Fabrication Conditions on Ultra-fine Abrasive Polishing Pad	期刊论文	Yunhe Zhang\|Jing Lu\|Hui Huang\|Xipeng Xu\|
50	Abrasive Particles Trajectory Analysis and Simulation of Cluster Magnetorheological Effect Plane Polishing	期刊论文	Jisheng Pan\|Qiusheng Yan\|Xipeng Xu\|Jiangting Zhu\|
51	Material removal mechanism of cluster magnetorheological effect plane polishing	期刊论文	Pan Jisheng\|Yan Qiusheng\|
52	Advanced Nano-finishing Process of SrTiO3 Substrate by Cluster MR-effect Plate	期刊论文	Bai Zhengwei\|Yan Qiusheng\|Lu Jiabin\|
53	隔离电极的电流变效应抛光装置及试验验证	期刊论文	路家斌\|阎秋生\|田虹\|
54	Effect of Abrasives on the Lapping Performance of 6H-SiC Single Crystal Wafer	期刊论文	Li Wei\|Yan Qiusheng\|Lu Jiabin\|Pan Jisheng\|
55	石材高效加工用金刚石磨粒工具关键技术及应用	奖励	徐西鹏\|黄辉\|李远\|郭桦\|沈剑云\|黄国钦\|
56	隔离电极的电流变效应抛光装置及试验验证	期刊论文	路家斌\|阎秋生 \|田虹\|
57	集群磁流变效应平面抛光力特性研究	期刊论文	白振伟\|阎秋生\|徐西鹏\|
58	Comparison of Fe Catalyst Species in Chemical Mechanical Polishing Based on Fenton Reaction for SiC Wafer	期刊论文	Wang Lei\|Yan Qiusheng\|Lu Jiabin\|Xiao Xiaolan\|

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