| 1 |
An analytical model of thermal mechanical stress induced by through silicon via
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期刊论文 |
Gang Dong;Tao Shi;Yinbo Zhao;Yintang Yang |
| 2 |
Universal Closed-Form Expressions for theInductance of Tapered Tthrough Silicon Vias(T-TSVs) Based on Vector MagneticPotential
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期刊论文 |
Zheng Mei;Gang Dong;Yintang Yang;Junping Zheng;Yingbo Zhao;Weijun Zhu |
| 3 |
Metal Proportion Optimization of Annular Through-Silicon Via Considering Temperature and Keep-Out Zone
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期刊论文 |
Xiangkun Yin;Zhangming Zhu;Yintang Yang |
| 4 |
Accurate Formulas for the Capacitance of Tapered-Through Silicon Vias in 3-D ICs
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期刊论文 |
Lu Qijun;Zhu Zhangming;Yang Yintang;Ding Ruixue |
| 5 |
A hybrid packet-circuit switched router for optical network on chip
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期刊论文 |
Li Hui;Gu Huaxi;Yang Yintang;Yu Xiaoshan |
| 6 |
High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits Considering Eddy-Current and Proximity Effects
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期刊论文 |
Lu Qijun;Zhu Zhangming;Yang Yintang;Ding Ruixue;Li Yuejin |
| 7 |
New Coaxial Through Siliocn Via(TSV) Applied forThree Dimensional Integrated Circuits(3D ICs)
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期刊论文 |
Yintang Yang;Junping Zheng;Gang Dong;Yinbo Zhao;Zheng Mei;Weijun Zhu |
| 8 |
On the design of a 3D optical interconnected memory system
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期刊论文 |
Kang Wang;Huaxi Gu;Yintang Yang;Ke chen |
| 9 |
A Highly Scalable Optical Network-on-chip withSmall Network Diameter and Deadlock Freedom
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期刊论文 |
Xiaolu Wang;Huaxi Gu;Yintang Yang;Qinfeng Hao |
| 10 |
Enhancing Performance of Cloud Computing Data Center Networks by Hybrid Switching Architecture
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期刊论文 |
Yu Xiaoshan;Gu Huaxi;Wu Gang;Wang Kun;Yu XS |
| 11 |
Electrical Modeling and Analysis of Cu-CNT Heterogeneous Coaxial Through-Silicon Vias
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期刊论文 |
Lu Qijun;Zhu Zhangming;Yang Yintang;Ding Ruixue;Li Yuejin |
| 12 |
硅通孔与三维集成电路
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专著 |
朱樟明;杨银堂 |
| 13 |
Venus: A Low-Latency, Low-Loss 3-D Hybrid Network-on-Chip for Kilocore Systems
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期刊论文 |
Tan Wei;Gu Huaxi;Yang Yintang;Wang Kun;Wang Xiaolu |
| 14 |
A 3D multilayer optical network on chip based on mesh topology
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期刊论文 |
Zhu Kexin;Gu Huaxi;Yang Yintang;Tan Wei;Zhang Bowen |
| 15 |
A Scalable AWG-based Data Center Network for Cloud Computing
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期刊论文 |
Gang Wu;Huaxi Gu;Kun Wang;Yantao Guo |
| 16 |
QBNoC: QoS-aware bufferless NoC architecture
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期刊论文 |
Zhang Na;Gu Huaxi;Yang Yintang;Fan Dongrui |
| 17 |
New Path-Setup Method for Optical Network-on-Chip
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期刊论文 |
Gu Huaxi;Gao Kai;Wang Zhengyu;Yang Yintang;Yu Xiaoshan |
| 18 |
A New Kilo-Core-Oriented Topology
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期刊论文 |
Naijun Zheng;Huaxi Gu;Xin Huang;Xiaokang Chen;CSquare |
| 19 |
用于集成系统和功率管理的多层次系统芯片低功耗设计技术
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奖励 |
杨银堂;朱樟明;刘帘曦;吴建兴;唐波;王良清;顾华玺;刘毅;丁瑞雪;周端 |
| 20 |
Inductance Modeling of Interconnections in 3-D Stacked-Chip Packaging
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期刊论文 |
Qu Chenbing;Liu Yang;Liu Xiaoxian;Zhu Zhangming;Zhu ZM |
| 21 |
A Novel Two-Layer Passive Optical Interconnection Network for On-Chip Communication
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期刊论文 |
Chen Ke;Gu Huaxi;Yang Yintang;Fan Dongrui;Chen K |
| 22 |
Accurate Formulas for the Capacitance of Tapered-Through Silicon Vias in 3-D ICs
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期刊论文 |
Lu Qijun;Zhu Zhangming;Yang Yintang;Ding Ruixue;Lu QJ |
| 23 |
Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs
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期刊论文 |
Yang Yintang;Liu Xiaoxian;Zhu Zhangming;Ding Ruixue;Yang YT |
| 24 |
Electrical Modeling and Characterization of Shield Differential Through-Silicon Vias
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期刊论文 |
Qijun Lu;Zhangming Zhu;Yintang Yang;Ruixue Ding. |
| 25 |
A 3D topology based-on partial overlapped clusters for NoC
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期刊论文 |
Min Li;Huaxi Gu;Yintang Yang;Kun Wang |
| 26 |
Modeling and Optimization of Multiground TSVs for Signals Shield in 3-D ICs
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期刊论文 |
Qu Chenbing;Ding Ruixue;Liu Xiaoxian;Zhu Zhangming;Qu Chenbing;Qu Chenbing;Ding Ruixue;Ding Ruixue;Zhu Zhangming;Liu Xiaoxian;Zhu Zhangming;Zhu ZM |
| 27 |
QBNoC: QoS-aware bufferless NoC architecture
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期刊论文 |
Zhang Na;Gu Huaxi;Yang Yintang;Fan Dongrui;Gu Huaxi;Gu HX |
| 28 |
Low-Loss Air-Cavity Through-Silicon Vias (TSVs) for High Speed Three-Dimensional Integrated Circuits (3-D ICs)
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期刊论文 |
Liu Xiaoxian;Zhu Zhangming;Yang Yintang;Ding Ruixue |
| 29 |
Universal method for designing non-blocking multicast-supported on chip optical router
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期刊论文 |
Wang Xuesong;Gu Huaxi;Wang Kun;Yang Yintang;Huang Lei |
| 30 |
Flyover Architecture for Cluster and TDM-Based Optical Network-On-Chip
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期刊论文 |
Zhang Bowen;Gu Huaxi;Chen Ke;Yang Yintang;Hao Qinfen;Zhang BW |
| 31 |
RingCube - An incrementally scale-out optical interconnect for cloud computing data center
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期刊论文 |
Yu Xiaoshan;Gu Huaxi;Yang Yintang;Wang Kun |
| 32 |
Network Condition-Aware Communication Mechanism for Circuit-Switched Optical Networks-on-Chips
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期刊论文 |
Tan Wei;Gu Huaxi;Yang Yintang;Fadhel Meaad;Zhang Bowen |
| 33 |
A Model of Air-Gap Through-Silicon Vias (TSVs) for Microwave Applications
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期刊论文 |
Liu Xiaoxian;Zhu Zhangming;Yang Yintang;Ding Ruixue |
| 34 |
Effectiveness of p+ Layer in MitigatingSubstrate Noise Induced by Through-Silicon Via for Microwave Applications
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期刊论文 |
Xiangkun Yin;Zhangming Zhu;Yingtang Yang;Ruixue Ding |
| 35 |
Parasitic effects of air-gap through-siliocnvias in high-speed three-dimensional integrated ciruits
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期刊论文 |
Xiaoxian Liu;Zhangming Zhu;Yintang Yang;Ruixue Ding;Yuejin Li |
| 36 |
RPNoC: A Ring-Based Packet-Switched Optical Network-on-Chip
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期刊论文 |
Xiaolu Wang;Huaxi Gu;Yintang Yang;Kun Wang Qi |
| 37 |
Low-Power Low-Latency Optical Network Architecture for Memory Access Communication
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期刊论文 |
Wang Yue;Gu Huaxi;Wang Kang;Yang Yintang;Wang Kun;Gu HX |
| 38 |
系统芯片低功耗关键设计技术
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奖励 |
杨银堂;朱樟明;刘帘曦;杨勇;周端;李娅妮;顾华玺;刘毅;王平;董刚;丁瑞雪 |
| 39 |
Optical interconnection network for parallel access to multi-rank memory in future computing systems
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期刊论文 |
Kang Wang;Huaxi Gu;Yintang Yang;Kun Wang |
| 40 |
Structure, electronic and mechanical properties of Ga1-xBxP alloys
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期刊论文 |
Zhao Bin;Zhang Junqin;Ma Huihui;Wei Qun;Yang Yintang |
| 41 |
Wideband Fourth-Harmonic Mixer Operated at 325-500 GHz
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期刊论文 |
Deng Jianqin;Lu Qijun;Yang Yingtang;Zhu Zhangming;Deng Jianqin;Jia Dinghong;Deng Jianqin;Jia Dinghong;Zhu ZM |
| 42 |
Capacitance characterization of tapered through-silicon-via considering MOS effect
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期刊论文 |
Wang Fengjuan;Zhu Zhangming;Yang Yintang;Liu Xiaoxian;Ding Ruixue;Wang FJ |
| 43 |
Type of distortionless through silicon via design based on the multiwalled carbon nanotube
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期刊论文 |
Lu Qijun;Zhu Zhangming;Yang Yintang;Ding Ruixue;Lu QJ |
| 44 |
Parasitic Inductance of Non-uniform Through-Silicon Vias (TSVs) for Millimeter Application
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期刊论文 |
Xiaoxian Liu Zhangming Zhu Yintang Yang;Ruixue Ding |
| 45 |
A Hierarchical Optical Network-On-Chip Using Central-Controlled Subnet and Wavelength Assignment
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期刊论文 |
Chen Zheng;Gu Huaxi;Yang Yintang;Fan Dongrui |
| 46 |
Influence of Temperature on the Conductivity of Multiwalled Carbon Nanotube Interconnects
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期刊论文 |
Qijun Lu Zhangming Zhu Yintang Yang;Ruixue Ding |
| 47 |
Low-Power Low-Latency Optical Network Architecture for Memory Access Communication
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期刊论文 |
Wang Yue; Gu Huaxi; Wang Kang; Yang Yintang; Wang Kun |
| 48 |
A Hierarchical Optical Network-On-Chip Using Central-Controlled Subnet and Wavelength Assignment
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期刊论文 |
Chen Zheng;Gu Huaxi;Yang Yintang;Fan Dongrui;Chen Z |
| 49 |
Electrical Modeling and Analysis of Differential Dielectric-Cavity Through-Silicon via Array
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期刊论文 |
Liu Xiaoxian;Zhu Zhangming;Yang Yintang;Ding Ruixue;Li Yuejin;Zhu ZM |
| 50 |
Thermo-mechanical characterization of single-walled carbon nanotube (SWCNT)-based through-silicon via (TSV) in (100) Silicon
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期刊论文 |
Xiangkun Yin Zhangming Zhu. Yintang Yang;Ruixue Ding |
| 51 |
An Effective Approach of Reducing the Keep-Out-Zone Induced by Coaxial Through-Silicon-Via
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期刊论文 |
Wang Fengjuan;Zhu Zhangming;Yang Yintang;Yin Xiangkun;Liu Xiaoxian;Ding Ruixue;Wang FJ |
| 52 |
High-Frequency Electrical Modeling and Characterization of Differential TSVs for 3-D Integration Applications
|
期刊论文 |
Qu Chenbing;Ding Ruixue;Zhu Zhangming;Zhu ZM |
| 53 |
Wideband Electromagnetic Model and Analysis of Shielded-Pair Through-Silicon Vias
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期刊论文 |
Liao Chenguang;Zhu Zhangming;Lu Qijun;Liu Xiaoxian;Yang Yintang |
| 54 |
Venus: A Low-Latency, Low-Loss 3-D Hybrid Network-on-Chip for Kilocore Systems
|
期刊论文 |
Wei Tan;Huaxi Gu;Yintang Yang;Kun Wang;Xiaolu Wang |
| 55 |
Analysis of propagation delay and repeater insertion in single-walled carbon nanotube bundle interconnects
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期刊论文 |
Lu Qijun;Zhu Zhangming;Yang Yintang;Ding Ruixue |
