团簇固溶的高化学稳定性导电Cu合金薄膜
序号 | 标题 | 类型 | 作者 |
---|---|---|---|
1 | Effects of distribution and growth orientation of precipitates onoxidation resistance of Cu–Cu12–[Crx/(121x)Ni12/(121x)]5 alloys | 期刊论文 | Xiaona Li|Lujie Jin|Kun Zhang|Chuang Dong| |
2 | Application of cluster-plus-glue-atom model to barrierless Cu–Ni–Ti and Cu–Ni–Ta films | 期刊论文 | Ding J X|Wang M|Chu J P|Dong C| |
3 | Stability and Microstructure Characterization of Barrierless Cu (Sn, C) Films | 期刊论文 | Li X N|Jin L J|Zhao L R|Dong C| |
4 | Thermal stability of barrierless Cu-Ni-Sn films | 期刊论文 | Zhao, L. R.|Bao, C. M.|Chu, J. P.|Dong, C.| |
5 | Ti 稳定N 的三元Cu 合金薄膜 | 期刊论文 | 李晓娜|赵丽荣|郑月红|董闯| |
6 | 基于团簇模型设计的Cu-Cu_(12)-[M_(x/(12+x))Ni_(12/(12+x))]_5(M=Si,Cr,Cr+Fe)合金抗高温氧化研究 | 期刊论文 | 李震|王苗|张坤|董闯| |
7 | Barrierless Cu-Ni-Nb thin films on silicon with high thermal stability and low electrical resistivity | 期刊论文 | Li Jun Liu|Cui Min Bao|Jinn P. Chu|Chuang Dong| |
8 | Carbon-doped Cu films with self-forming passivation layer | 期刊论文 | Xu, L. Y.|Bao, C. M.|Chu, J. P.|Dong, C.| |