3D封装多次回流Sn/Cu钎焊界面反应及控制机制

51871040
2018
E0101.金属材料设计、计算与表征
马海涛
面上项目
教授
大连理工大学
60万元
3D封装;无铅焊料;多次回流焊;界面反应机理;金属间化合物
2019-01-01到2022-12-31
  • 中英文摘要
  • 结题摘要
  • 结题报告
  • 项目成果
  • 项目参与人
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序号 标题 类型 作者
1 Effect of Initial Grain Size on Growth Behavior of Intermetallic Compounds on (001)Cu During Aging 会议论文 Chong Dong;Haoran Ma;Dan Zhang;Xiaofu Li;Jie Yu;Liuhong Yang;Haitao Ma
2 Study on the coordination agent system of Sn-Ag-Cu ternary alloy co-deposition 会议论文 Liying Sun;Chen Wang;Shengyan Shang;Jun Chen;Yunpeng Wang;Haitao Ma
3 Effect of substrate surface roughness on interfacial reaction at Sn-3.0Ag/(001)Cu interface 期刊论文 Chong Dong;Min Shang;Haoran Ma;Yunpeng Wang;Haitao Ma
4 Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint 期刊论文 Shang Shengyan;Wang Yanfeng;Wang Yunpeng;Ma Haitao;Kunwar Anil
5 Integration of machine learning with phase field method to model the electromigration induced Cu_6Sn_5 IMC growth at anode side Cu/Sn interface 期刊论文 Kunwar Anil;Coutinho Yuri Amorim;Hektor Johan;Ma Haitao;Moelans Nele
6 Analysis and control of Cu6Sn5 preferred nucleation on single crystal (001)Cu 期刊论文 Ma H. R.;Dong C.;Zhao N.;Wang Y. P.;Li X. G.;Ma H. T.;Chen J.
7 Effect of the degree of supercooling on growth mechanism of Cu6 Sn5 in pure Sn/Cu solder joint 期刊论文 Bingfeng Guo;Haitao Ma;Anil Kunwar;Xinhon g Chu
8 New phenomenon: Cellular boundary during the isothermal stage in the Sn-3Ag/(0 0 1)Cu and Sn-3.5Ag/(0 0 1)Cu joint 期刊论文 Chong Dong;Jinye Yao;Min Shang;Haoran Ma;Jun Chen;Haitao Ma;Yunpeng Wang
9 Investigation on growth of the orientation-preferred Cu6Sn5 on (001)Cu during the temperature-increased multiple reflow process 期刊论文 Chong Dong;Min Shang;Fei Chen;Yunpeng Wang;Xiaogan Li;Haoran Ma;Haitao Ma
10 Effect of composition and size of Sn based solder on Cu3Sn growth in interfacial reaction 会议论文 Min Shang;Dan Zhang;Xiaofu Li;Ying Guo;Haitao Ma;Siyu Shang
11 Solid-state interfacial reaction of Sn-Ag solders with polycrystalline Cu and (001) Cu substrate 期刊论文 Tianhao Guo;Chong Dong;Haitao Ma;Haoran Ma;Yunpeng Wang
12 Cu_5Zn_8和Sn/Ag_3Sn/Ag扩散阻挡层在Sn/Cu钎焊互连界面反应中的作用 期刊论文 姚金冶;陈祥序;李花;马海涛;王云鹏;马浩然
13 Simulation for Cu Atom Diffusion Leading to Fluctuations in Solder Properties and Cu6Sn5 Growth during Multiple Reflows 期刊论文 Min Shang;Chong Dong;Haoran Ma;Yunpeng Wang;Haitao Ma
14 Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文 Huang Ru;Ma Haoran;Shang Shengyan;Kunwar Anil;Wang Yunpeng;Ma Haitao
15 Effects of TiO2 nanoparticles addition on physical and soldering properties of Sn-xTiO(2) composite solder 期刊论文 Liu Zhiyuan;Ma Haoran;Shang Shengyan;Wang Yunpeng;Li Xiaogan;Ma Haitao
16 Reliability study of 3D IC structure under thermal power consumption load by Finite Element Simulation 会议论文 Hang Yuan;Haoran Ma;Tianhao Guo;Jing Xing;Ying Guo;Haitao Ma
17 The interfacial reaction of Cu/rnultilayer Sn -Cu -Sn / Cu joint in soldering 会议论文 Min Shang;Chong Dong;Xiangxu Chen;Shaocheng Wu;Haoran Ma;Haitao Ma
18 Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux 期刊论文 Shang Shengyan;Kunwar Anil;Yao Jinye;Ma Haitao;Wang Yunpeng
19 Effects of gelatin, thiourea, and chloride ions on the nanostructure of copper film prepared by electrodeposition 会议论文 Tianhao Guo;Hang Yuan;Dan Zhang;Xinfeng Ning;Haitao Ma;Haoran Ma
20 Significant effect of orientation on Cu6Sn5 coarsening behavior in isothermal aging process 期刊论文 Dong Chong;Ma Haoran;Hussain MuhammadMuzammal;Sun Liying;Chen Jun;Wang Yunpeng;Li Xiaogan;Ma Haitao
21 Mechanism on the nucleation of orientation-preferred Cu6Sn5 at different temperatures and solder compositions 期刊论文 Chong Dong;Min Shang;Haoran Ma;Yunpeng Wang;Xiaogan Li;Haitao Ma
22 The study of edge effects in Sn-0.5Cu/(001)Cu during soldering cooling stage 会议论文 Chong Dong;Shaocheng Wu;Haoran Ma;Yunpeng Wang;Haitao Ma
23 A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering 期刊论文 Kunwar Anil;An Lili;Liu Jiahui;Shang Shengyan;Raback Peter;Ma Haitao;Song Xueguan
24 Effect of TiO2 nanoparticle on intermetallic compounds growth of Cu/Sn/Cu Solder Joint 会议论文 Yanfeng Wang;Shengyan Shang;Haitao Ma;Shaocheng Wu;Weifeng Li;Tuo Feng;Haitao Ma
25 Effect of concentration of thiourea and ammonium citrate, electrodeposition stirring speed and current density on Sn-Ag-Cu coating for small size substrate 会议论文 Guo Ying;Ma Haoran;Ning Xinfeng;Li Xiaofu;Yuan Hang;Ma Haitao
26 Effect of the TiO2 Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints 期刊论文 Shang Shengyan;Kunwar Anil;Yao Jinye;Wang Yanfeng;Ma Haitao;Wang Yunpeng
27 一种多次回流过程中调控微焊点Sn晶粒取向的方法 专利 赵宁;乔媛媛;马海涛
28 Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文 Shengyan Shang;Anil Kunwar;Yanfeng Wang;Lin Qu;Haitao Ma;Yunpeng Wang
29 Significant Effect of Temperature and Solders on The Growth Behavior of CU6Sn5 on (110) Cu Single Crystal 会议论文 Chong Dong;Min Shang;Ying Guo;Xiangxu Chen;Jun Zhang;Changlong Dong;Haoran Ma;Haitao Ma
30 Electrochemical migration behavior of Sn-based lead-free solder 期刊论文 Qi Xiao;Ma Haoran;Wang Chen;Shang Shengyan;Li Xiaogan;Wang Yunpeng;Ma Haitao
31 Growth mechanism and kinetics of Cu3Sn in the interfacial reaction between liquid Sn and diversely oriented Cu substrates 期刊论文 Min Shang;Chong Dong;Haoran Ma;Haitao Ma;Yunpeng Wang
32 Geometrical Effects of Cu@Ag Core-Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints 期刊论文 Shang Shengyan;Kunwar Anil;Wang Yanfeng;Yao Jinye;Wu Yingchao;Ma Haitao;Wang Yunpeng
33 Convolutional neural network model for synchrotron radiation imaging datasets to automatically detect interfacial microstructure: An in situ process monitoring tool during solar PV ribbon fabrication 期刊论文 Kunwar Anil;Malla Prafulla Bahadur;Sun Junhao;Qu Lin;Ma Haitao
34 Competitive growth of Cu3Sn and Cu6Sn5 at Sn/Cu interface during various multi-reflow processes 期刊论文 Min Shang;Chong Dong;Jinye Yao;Chen Wang;Haoran Ma;Haitao Ma;Yunpeng Wang
35 Electrochemical Migration behavior of Sn9Zn 会议论文 Xiao Qi;Haoran Ma;Xiaogan Li;Shengyan Shang;Yunpeng Wang;Haitao Ma
36 Growth behavior of Cu6Sn5 Grains at Sn3.0Ag/(001)Cu Soldering Interface 会议论文 Haoran Ma;Chong Dong;Shi Chen;Shengyan Shang;Yiling Liu;Yunpeng Wang;Xiaogan Li;Haitao Ma
37 Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface 期刊论文 Zhu Zhidan;Ma Haoran;Shang Shengyan;Ma Haitao;Wang Yunpeng;Li Xiaogan
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