基于光产酸剂和聚碳酸亚丙酯的临时键合/自动解键合研究

61804132
2018
F0406.集成电路器件、制造与封装
朱智源
青年科学基金项目
教授
西南大学
24万元
键合;硅通孔;三维集成;临时键合;三维封装
2019-01-01到2021-12-31
  • 中英文摘要
  • 结题摘要
  • 结题报告
  • 项目成果
  • 项目参与人
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序号 标题 类型 作者
1 Modeling simplification for thermal mechanical stress analysis of TSV interposer stack 期刊论文 Xia Kequan;Zhu Zhiyuan;Zhang Hongze;Xu Zhiwei
2 A high strength triboelectric nanogenerator based on rigid-flexible coupling design for energy storage system 期刊论文 Xia Kequan;Tang Haichao;Fu Jiangming;Tian Yang;Xu Zhiwei;Lu Jianguo;Zhu Zhiyuan
3 Design of Polymer Bonding Scheme and its Application for Triboelectronic Nanogenerator Integration 会议论文 Hanyi Luo;Jiao Chen;Guangxin Zhao;Zhiyuan Zhu;hongze zhang;jing guo
4 Low Temperature and Short Time Au/Sn Solidliquid Diffusion Bonding for 3D Integration 会议论文 Ziyu Liu;Wang Wenchao;Zhu Zhiyuan;Chen Lin;Sun Qingqing
5 Temporary Bonding Using Paper Inserted PPC Layer 期刊论文 Zhu Zhiyuan;Xia Kequan;Xu Zhiwei;Zhang Hongze;Lou Haijun
6 Bonding of aluminum coated silicon wafers based on polypropylene carbonate and as a multi-functional sensor 期刊论文 Zhiyuan Zhu;Kequan Xia;Jiangmin Fu;Chaolin Du;Hongze Zhang;Haijun Lou;Zhiwei Xu
7 Design and Simulation of 3D Antenna Based on Conical Via Structure 会议论文 Ziyu Liu;Junhao Wang;Zhiyuan Zhu;Lin Chen;Qingqing Sun
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