微电子封装焊锡钎料多轴蠕变疲劳研究

10272080
2002
A0802.固体强度、损伤、断裂与疲劳
陈旭
面上项目
教授
天津大学
26万元
多轴疲劳多轴蠕变焊锡钎料
2003-01-01到2005-12-31
  • 中英文摘要
  • 结题摘要
  • 结题报告
  • 项目成果
  • 项目参与人
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序号 标题 类型 作者
1 Fatigue life of 63Sn-37Pb solder related to load drop under uniaxial and torsional loading. 期刊论文 Chen X.|Song J.|Kim K.S.|
2 fleXBGA reliability based on finite element analysis. 期刊论文 Chen Gang|Chen Xu||
3 FEM analysis with cyclic visco-plasticity for solder bumped flip-chip packaging. 会议论文 Chen X.|Lin Y.C.|Liu X.S.|Lu G-Q|
4 Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability. 期刊论文 Chen X.|Lin Y.C.|Liu X|Lu Guo-Quan|
5 Cyclic stress-strain relationship of 63Sn37Pb solder under biaxial proportional and non-proportional loading. 期刊论文 Chen X.|Chen G.|
6 A Simple Constitutive Model for ratcheting Evolution of 63Sn-37Pb solder under multiaxial loading. 期刊论文 Chen X.|Yu D.H||
7 Constitutive and damage model for 63Sn37Pb solder under uniaxial and torsional loading 期刊论文 Chen Gang|Chen Xu|
8 Low cycle fatigue life prediction of 63Sn-37Pb solder under proportional and non-proportional loading. 期刊论文 Chen X.|Song J.|Kim K.S.|
9 Investigation of moisture diffusion in epoxy system: experiments and molecular dynamics simulations. 期刊论文 Lin Y.C.|Chen X.|
10 Microscopic observation of failure mechanism of Anisotropic Conductive Film for Flip-chip joining, 会议论文 Chen X.|Zhang J.|Wang Z.P|
11 Experimental study on ratcheting behavior of eutectic tin-lead solder under multiaxial loading. Materials 期刊论文 Chen X.|Yu De-Hua|Kim Kwang Soo|
12 Tensile Stress-Strain Curves Modeling of Four Kinds of Solders with Temperature and Rate Dependence, 期刊论文 Chen X.|Zhang L.|Sakane M.|Nose H.|
13 Prediction of Stress-strain Relationship with An Improved Anand Constitutive Model for lead free solder Sn-3.5Ag. 期刊论文 |X. Chen|G. Chen|M Sakane|
14 An modified Anand Constitutive Model for lead free solder Sn-3.5Ag. 会议论文 Chen X.|Chen G.|Sakane M|
15 Anand模型预测63Sn37Pb焊锡钎料的应力应变行为 期刊论文 张莉|陈旭|Sakane M.|Nose H.|
16 Effect of substrate flexibility on solder joint reliability - part II: finite element modeling. 期刊论文 Lin Y.C.|Chen X.|Liu X.S.|LuG.Q.|
17 Moisture absorption and diffusion characterization of molding compound. 期刊论文 Chen X.|Zhao Shufeng|Zhai L.|
18 Uniaxial ratcheting behavior of 63Sn37Pb solder with loading histories and stress rates. 期刊论文 Chen Gang|Chen Xu|Niu Chang-dong|
19 多轴非比例载荷下金属材料低周疲劳研究 奖励 陈旭(天津大学)|何国求(同济大学)|陈成澍(同济大学)|高庆(西南交通大学)|许爽燕(天津大学)|安柯(天津大学)|高红(天津大学)|王东方（同济大学）|田涛(天津大学)|张巧丽(天津大学)|
20 Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection. 期刊论文 Chen X.|Zhang J. Jiao C.L.|Liu Y.M.|
21 Evaluation of multiaxial low-cycle fatigue for 63Sn-37Pb solder 期刊论文 X. Chen|D. Jin|M Sakane|T. Yamamoto|
22 Bonding parameters of anisotropic conductive adhesive film and peeling strength. 期刊论文 Chen X.|Zhang J. Jiao C.L.|Liu Y.M.|
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