应用于先进电子封装的低熔点高熵合金焊料焊接性与可靠性研究

51901022
2019
E0101.金属材料设计、计算与表征
刘影夏
青年科学基金项目
研究员
香港城市大学深圳研究院
25万元
无铅焊料;高熵合金;封装可靠性;电迁移;三维封装
2020-01-01到2022-12-31
  • 中英文摘要
  • 结题摘要
  • 结题报告
  • 项目成果
  • 项目参与人
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序号 标题 类型 作者
1 Ultra-thin intermetallic compound formation in microbump technology by the control of a low Zn concentration in solder 期刊论文 Yingxia Liu;Li Pu;Andriy Gusak;Xiuchen Zhao;Chengwen Tan;K.N. Tu
2 Low melting point solders based on Sn, Bi, and In elements 期刊论文 Yingxia Liu;K.N. Tu
3 四元共晶焊料及制备方法、以及焊料成分 专利 刘影夏;刘浩洋;郭振华;姜嘉骅;任心同
4 A high-entropy alloy as very low melting point solder for advanced electronic packaging 期刊论文 Yingxia Liu;Li Pu;Yong Yang;Quanfeng He;Ziqing Zhou;Chengwen Tan;Xiuchen Zhao;Qian Zhang;King-Ning Tu
5 A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly 期刊论文 Lingyao Sun;Zhenhua Guo;Xiuchen Zhao;Ying Liu;Kingning Tu;Yingxia Liu
6 Surface diffusion controlled reaction in small size microbumps 期刊论文 Yingxia Liu;Xiuyu Shi;Haoxiang Ren;Jian Cai;Xiuchen Zhao;Chengwen Tan;K.N. Tu
7 Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation 期刊论文 Li Pu;Yingxia Liu;Yong Yang;Quanfeng He;Ziqing Zhou;Xiuchen Zhao;Chengwen Tan;K.N. Tu
8 Effects of endogenous Al and Zn phases on mechanical properties of Sn58Bi eutectic alloy 期刊论文 Yuhang Wei;Yingxia Liu;Lei Zhang;Xiuchen Zhao
9 光滑均匀四元共晶合金颗粒的制备方法及合金颗粒 专利 刘影夏;杨明坤
10 Effects of minor alloying with Ge and In on the interfacial microstructure between Zn–Sn solder alloy and Cu substrate 期刊论文 Yuhang Wei;Yingxia Liu;Xiuchen Zhao;Chengwen Tan;Yaru Dong;Ji Zhang
11 Atomic insights of Cu nanoparticles melting and sintering behavior in Cu Cu direct bonding 期刊论文 Rui Wu;Xiuchen Zhao;Yingxia Liu
12 The Microstructure and Mechanical Property of the High Entropy Alloy as a low Temperature Solder 会议论文 Li Pu;Quanfeng He;Yong Yang;Xiuchen Zhao;Zhuangzhuang Hou;K.N.Tu;Yingxia Liu
13 Undercooling and microstructure analysis for the design of low melting point solder 会议论文 Li Pu;Yongjun Huo;Xiuchen Zhao;King-Ning Tu;Yingxia Liu
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