可降低污染的含锰ABS表面微蚀新体系的构建

21273144
2012
B0205.电化学
王增林
面上项目
教授
陕西师范大学
82万元
ABS;化学镀铜;粘接强度;塑料;化学微蚀;表面微蚀
2013-01-01到2016-12-31
  • 中英文摘要
  • 结题摘要
  • 结题报告
  • 项目成果
  • 项目参与人
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序号 标题 类型 作者
1 Investigation of Nitrogen Heterocyclic Compounds as Levelers for Electroplating Cu Filling by Electrochemical Method and Quantum Chemical Calculation 期刊论文 Ren, Shaojun|Lei, Zhanwu|Wang, Zenglin|
2 Investigation of suppressor polyethylene glycol dodecyl ether on electroplated Cu filling by electrochemical method 期刊论文 Ren, S.|Lei, Z.|Wang, Z.|
3 Surface modification of ABS by photocatalytic treatment for electroless copper plating 期刊论文 Ma, Qian|Li, Lisha|Li, Xirong|Wang, Zenglin|
4 Adhesion improvement of electroless copper to PC substrate by a low environmental pollution MnO2-H3PO4-H2SO4-H2O system 期刊论文 Zhao, Wenxia|Wang, Zenglin|
5 Adhesion improvement of electroless copper to ABS resin by low environmental pollution surface etching system 期刊论文 Zhao, W. X.|Wang, Z. L.|
6 Tetrazole Derived Levelers for Filling Electroplated Cu Microvias: Electrochemical Behaviors and Quantum Calculations 期刊论文 Chen, Long|Wang, Wenliang|Wang, Zenglin|Zhao, Chuan|
7 A Study of Low Temperature and Low Stress Electroless Copper Plating Bath 期刊论文 Zhao, Wen-Xia|Ma, Qian|Lu, Xu-Bin|Wang, Zeng-Lin|
8 Study of an environment-friendly surface pretreatment of ABS-polycarbonate surface for adhesion improvement 期刊论文 Zhao, Wenxia|Li, Xirong|Li, Lisha|Wang, Zenglin|
9 A study of bottom-up electroplated copper filling by the potential difference between two rotating speeds of a working electrode 期刊论文 Lu, Xubin|Yao, Longjie|Ren, Shaojun|Wang, Zenglin|
10 Achievement of Bottom-Up Electroless Nickel Filling on the SiO2 Surface with Pd-Activated SAM 期刊论文 Zan, Lingxing|Wang, Zenglin|Liu, Zonghuai|Yang, Zupei|
11 Improvement in the Etching Performance of the Acrylonitrile-Butadiene-Styrene Resin by MnO2-H3PO4-H2SO4 Colloid 期刊论文 Zhao, Wenxia|Ding, Jie|Wang, Zenglin|
12 Electrochemical Synthesis of Continuous Controllable Ag Nanoparticles from Quaternary Ionic Liquid Microemulsions and Electrocatalytic Activity 期刊论文 Li, Yuhan|Wang, Zenglin|Zhao, Chuan|
13 2-Mercaptopyridine as a new leveler for bottom-up filling of micro-vias in copper electroplating 期刊论文 Lu, Xubin|Lei, Zhanwu|Wang, Zenglin|Zhao, Chuan|
14 Electrochemical Research of a Stable Electroless Silver Bath 期刊论文 Chun Chang|Zhanwu Lei|Yuhan Li|Zenglin Wang|
15 A study of the environmentally friendly polycarbonate surface etching system containing H2SO4-MnO2 colloid 期刊论文 Zhao, Wenxia|Li, Zhixin|Wang, Zenglin|
16 The effect of TiO2 morphology on the surface modification of poly (ethylene terephthalate) for electroless plating 期刊论文 Qiang, Qi|Zhao, Juan|Yang, Junjun|Wang, Zenglin|
17 Controllable electrochemical synthesis of Ag nanoparticles in ionic liquid microemulsions 期刊论文 Li, Yuhan|Qiang, Qi|Zheng, Xingwang|Wang, Zenglin|
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