次磷酸钠化学镀铜体系的基础研究及超级化学铜填充

20873080
2008
B0205.电化学
王增林
面上项目
教授
陕西师范大学
34万元
次磷酸钠;化学镀铜;化学沉积;超级化学镀铜
2009-01-01到2011-12-31
  • 中英文摘要
  • 结题摘要
  • 结题报告
  • 项目成果
  • 项目参与人
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序号 标题 类型 作者
1 Effects of Triethanolamine and K(4)[Fe(CN)(6)] upon Electroless Copper Plating 期刊论文 Wang, Xu|Wang, Zenglin|Yang, Zhifeng|Li, Na|
2 Design and achievement of a complete bottom-up electroless copper filling for sub-micrometer trenches 期刊论文 Zenglin Wang|Zhifeng Yang|Zhixiang Wang|Xu Wang|Na Li|
3 An Environment-Friendly Surface Pretreatment of ABS Resin Prior to Electroless Plating 期刊论文 Yin, Lie|Li, Zhixin|Wang, Zenglin|Li, Na|He, Yue|
4 Adhesion Improvement of ABS Resin to Electroless Copper by H2SO4-MnO2 Colloid with Ultrasound-Assisted Treatment 期刊论文 NaLi|ZhunLi|ZhifengYang|ZenglinWang|YueHe|
5 Pd-free surface activation technique for ABS surface metallisation 期刊论文 Z. L. Wang|Y. He|X. Wang|X. L. Yuan|Z. F. Yang|
6 First Synergy Effects of SPS and PEG-4000 on the Bottom-Up Filling in Electroless Copper Plating 期刊论文 Liu, Zonghuai|Yang, Zhifeng|Wang, Xu|Li, Na|Wang, Zenglin|Yang, Zupei|
7 Comparison of Bottom-up Filling in Electroless Plating with an Addition of PEG，PPG and EPE 期刊论文 Wang, Xu|wang, Zenglin|Yang, Zhifeng|Wang, Zhixiang|
8 超级化学镀铜填充微道沟的研究 期刊论文 Gao Yanlei|Wang Zenglin|Li Na|Yin Lie|Yang Zhifeng|Wang Xu|
9 A Synergy Effect of 2-MBT and PE-3650 on the Bottom-Up Filling in Electroless Copper Plating 期刊论文 ZuPei Yang|ZengLin Wang|LingXing Zan|ZongHuai Liu|
10 亚氨基二乙酸为络合剂的新型化学镀铜研究 期刊论文 王增林|袁雪莉|杨志峰|高剑|王智香|
11 Bottom-Up Filling in Electroless Plating with an Addition of PEG-PPG Triblock Copolymers 期刊论文 Wang, Zhixiang|Wang, Xu|Li, Na|Wang, Zenglin|Yang, Zhifeng|
12 Study of an Environmentally Friendly Surface Etching System of ABS for Improving Adhesion of Electroless Cu film 期刊论文 He, Yue|Li, Zhixin|Wang, Zhixiang|Wang, Zenglin|
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