Sn基钎料/Cu焊点界面单晶Cu6Sn5形态及其固态相变机理研究

51175116
2011
E0508.成形制造
李明雨
面上项目
教授
哈尔滨工业大学
60万元
软钎焊界面;Cu6Sn5;组织形态;固态相变
2012-01-01到2015-12-31
  • 中英文摘要
  • 结题摘要
  • 结题报告
  • 项目成果
  • 项目参与人
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序号 标题 类型 作者
1 Cu6Sn5 precipitation during Sn-based solder/Cu joint solidification and its effects on the growth of interfacial intermetallic compounds 期刊论文 Joo, Sungmin|Chen, Hongtao|Ma, Xin|Li, Mingyu|
2 面向MEMS立体封装和组装微锡球键合工艺与设备 奖励
3 Fabrication of Cu6Sn5 single-crystal layer for under-bump metallization in flip-chip packaging 期刊论文 Zhang, Zhihao|Li, Mingyu|Wang, Chunqing|
4 Cathodic peeling damage of Cu6Sn5 phase in Cu/SnAg3.0Cu0.5/Cu bridge interconnections under current stressing 期刊论文 Huijun Cao|Mingyu Li|Yi Wang|Zhiquan Liu|
5 Fabrication of Cu6Sn5 single-crystal layer for under-bump metallization in flip-chip packaging 期刊论文 Zhang, Zhihao|Li, Mingyu|Wang, Chunqing|
6 Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves 期刊论文 Li, Zhuolin|Li, Mingyu|Xiao, Yong|Wang, Chunqing|
7 Solid-state interfacial reaction of eutectic Sn3.5Ag and pure tin solders with polycrystalline Cu substrate 期刊论文 Ma, Xin|Li, Mingyu|Cao, Yong|Kim, Jongmyung|
8 Interfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-state soldering 期刊论文 Yang, Ming|Li, Mingyu|Wang, Chunqing|
9 Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves 期刊论文 Li, Zhuolin|Li, Mingyu|Xiao, Yong|Wang, Chunqing|
10 Interfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-state soldering 期刊论文 Yang, Ming|Li, Mingyu|Wang, Chunqing|
11 Cathodic peeling damage of Cu6Sn5 phase in Cu/SnAg3.0Cu0.5/Cu bridge interconnections under current stressing 期刊论文 Cao, H. J.|Li, M. Y.|Wang, Y.|Liu, Z. Q.|
12 Solid-state interfacial reaction of eutectic Sn3.5Ag and pure tin solders with polycrystalline Cu substrate 期刊论文 Ma, Xin|Li, Mingyu|Cao, Yong|Kim, Jongmyung|
13 Texture evolution and its effects on growth of intermetallic compounds formed at eutectic Sn37Pb/Cu interface during solid-state aging 期刊论文 Yang, Ming|Li, Mingyu|Kim, Jongmyung|
14 Rapid formation of Cu/Cu3Sn/Cu joints using ultrasonic bonding process at ambient temperature 期刊论文 Li, Mingyu|Li, Zhuolin|Xiao, Yong|Wang, Chunqing|
15 Texture evolution and its effects on growth of intermetallic compounds formed at eutectic Sn37Pb/Cu interface during solid-state aging 期刊论文 Yang, Ming|Li, Mingyu|Kim, Jongmyung|
16 Rapid formation of Cu/Cu3Sn/Cu joints using ultrasonic bonding process at ambient temperature 期刊论文 Li, Mingyu|Li, Zhuolin|Xiao, Yong|Wang, Chunqing|
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