面向MEMS低温后道封装的膜材料选择性电磁感应局部加热及互连原理

50875063
2008
E0508.成形制造
李明雨
面上项目
教授
哈尔滨工业大学
35万元
电磁感应;后道封装;MEMS封装;微连接;选择性加热
2009-01-01到2011-12-31
  • 中英文摘要
  • 结题摘要
  • 结题报告
  • 项目成果
  • 项目参与人
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重置
序号 标题 类型 作者
1 Abnormal accumulation of intermetallic compound at cathode in a SnAg(3.0)Cu(0.5) lap joint during electromigration 期刊论文 Chang, Hong|Li, Mingyu|Pang, Xiaochao|Wang, Ling|Fu, Yonggao|
2 Local melt process of solder bumping by induction heating reflow 期刊论文 Kim, Jongmyung|Wang, Ling|Xu, Hongbo|Fu, Yonggao|Li, Mingyu|
3 Nanoindentation characteristics of Cu6Sn5 formed in lead free solder joints 会议论文 Mingyu Li|Zhihao Zhang|
4 Growth behavior of Cu(6)Sn(5) grains formed at an Sn3.5Ag/Cu interface 期刊论文 Kim, Jongmyung|Fu, Yonggao|Yang, Ming|Li, Mingyu|Weng, Lvqian|Wang, Ling|
5 Dramatic morphological change of interfacial prism-type Cu 6Sn5 in the Sn3.5Ag/Cu joints reflowed by induction heating 会议论文 Fu, Yonggao|Yang, Ming|Xu, Hongbo|Wang, Ling|Li, Mingyu|
6 Textured growth of Cu6Sn5 grains formed at a Sn3.5Ag/Cu interface 期刊论文 Li, Mingyu|Yang, Ming|
7 典型高端家电产品绿色制造关键技术研究及应用 奖励 宋守许|吴国平|赵新|李明雨|符永高|
8 Lead-Free Bumping Using an Alternating Electromagnetic Field 期刊论文 Xu, Hongbo|Li, Mingyu|Chen, Hongtao|Fu, Yonggao|Wang, Ling|
9 Cu(6)Sn(5) Morphology Transition and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints 期刊论文 Yang, Ming|Wang, Ling|Fu, Yonggao|Weng, Lvqian|Li, Mingyu|Kim, Jongmyung|
10 Polymorphic transformation mechanism of eta and eta '; in single crystalline Cu(6)Sn(5) 期刊论文 Li, M. Y.|Kim, J. M.|Zhang, Z. H.|
11 2010 Highly Commended Award 奖励 Hongbo Xu|Mingyu Li|Yonggao Fu|
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