基于表面纳米阵列材料的高可靠性电子封装技术

60876071
2008
F0406.集成电路器件、制造与封装
李明
面上项目
教授
上海交通大学
40万元
Pd;PPF引线框架;界面可靠性;电子封装;纳米针阵列
2009-01-01到2011-12-31
  • 中英文摘要
  • 结题摘要
  • 结题报告
  • 项目成果
  • 项目参与人
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序号 标题 类型 作者
1 Structural control of a cobalt nanocone array grown by directional electrodeposition 期刊论文 Hu, Anmin|Li, Ming|Mao, Dali|Hang, Tao|
2 晶格取向对铜氧化失效的影响 会议论文 毛大立|赵文婷|李明|胡安民|高婕|
3 Wetting Behavior of Electrolyte in Fine Pitch Cu/Sn Bumping Process by Electroplating 会议论文 李明|
4 Fine pitch and high density Sn bump fabrication 会议论文 Mao, Dali|Li, Ming|Jiang, Jin|Bi, Jinglin|Hu, Anmin|Suga, Tadatomo|
5 Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodeposition 期刊论文 Ling, Huiqin|Mao, Dali|Hu, Anmin|Li, Ming|Hang, Tao|
6 Electroless plating of copper nano-coned array for high reliability packaging 会议论文 Anmin, Hu|Dali, Mao|Ming, Li|Zhongwen, Pan|Yingying, Duan|Tao, Hang|
7 Through-silicon via filling process using pulse reversal plating 会议论文 Huiqin, Ling|Xianxian, Yu|Xinxin, Yang|Dongyan, Ding|Ming, Li|Dali, Mao|
8 基于表面纳米阵列结构的高疏水性材料及其制备方法 专利 郭 炜; 申筱濛; 吴洁晨; 孙怡婧; 张一木; 李 明
9 Study on the adhesion and reliability of Epoxy Molding Compound and shaped Pd Preplated leadframes 会议论文 Mao, Dali|Zhang, Wenjing|Ni, Mingzhi|Li, Ming|
10 Sample preparation device for molding compound adhesion test 会议论文 Li, Ming|Lu, Qin|Mao, Dali|Zhang, Wenjing|
11 Influence of leveler concentration on copper electrodeposition for through silicon via filling 会议论文 Dali, Mao|Huiqin, Ling|Haiyong, Cao|Yuliang, Guo|Han, Yu|Ming, Li|
12 Superhydrophobic nickel films fabricated by electro and electroless deposition 期刊论文 Li Ming|Tian Feifei|Mao Dali|Hu Anmin|
13 Adhesion improvement of Epoxy Molding Compound －Pd Preplated leadframe interface using shaped nickel layers 期刊论文 Mao Dali|Ni Mingzhi|Li Ming|
14 表面Co基微纳米针状晶布阵结构的制备方法 专利 李明; 胡安民; 刘开林; 杭弢; 罗庭碧
15 Oxidation behavior of Sn-9Zn-3Bi-xCr solders under high-temperature exposure 会议论文 Hu, Jing|Hu, Anmin|Mao, Dali|Li, Ming|
16 Thermal stability and electrical characteristics of NiSi films with electroplated Ni(W) alloy 期刊论文 Hu, Anmin|Mao, Dali|Li, Ming|Xin, Yuhang|
17 Wetting process of electrolyte in high density Cu/Sn micro-bumps electrodepositing 期刊论文 Hu, Anmin|Li, Ming|Hang, Tao|Bi, Jinglin|Ling, Huiqin|
18 Study on properties of low-Ag Content Sn-Ag-Zn lead-free solders 会议论文 Hu, Jing|Luo, Tingbi|Chen, Xi|Li, Ming|Hu, Anmin|
19 Through silicon via filling by copper electroplating in acidic cupric methanesulfonate bath 会议论文 Zuyang, Bian|Qi, Li|Dali, Mao|Huiqin, Ling|Ming, Li|Haiyong, Cao|
20 The evolution of interfacial microstructure of Sn3.5Ag solder bump with Cu under-bump metallization 会议论文 Li, Ming|Hu, Anmin|Mao, Dali|Bi, Jinglin|
21 Depressing effect of 0.1 wt.% Cr addition into Sn-9Zn solder alloy on the intermetallic growth with Cu substrate during isothermal aging 期刊论文 Hu, Jin|Hu, Anmin|Mao, Dali|Li, Ming|
22 Studies on microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder 会议论文 Anmin, Hu|Ming, Li|Tingbi, Luo|Dali, Mao|
23 表面金属基纳米阵列球布阵结构的制备方法 专利 吴洁晨; 孙怡婧; 郭 炜; 张一木; 申筱濛; 李 明
24 Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution 期刊论文 Luo, Tingbi|Hu, Jing|Li, Ming|Mao, Dali|Hu, Anmin|
25 Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder and Cu/electroplated Ni substrates 期刊论文 Bi, Jinglin|Luo, Tingbi|Li, Ming|Hu, Anmin|Hu, Jing|Mao, Dali|
26 Preparation of super-hydrophobic Cu-Ni coating with micro-nano hierarchical structure 期刊论文 Li Ming|Yu Zheyin|Chen Zhuo|Zhang Wenjing|
27 Influence of crystal orientation on copper oxidation failure 期刊论文 李明|
28 Simulation of electric field uniformity in through silicon via filling 会议论文 Li, Ming|Cao, Haiyong|Mao, Dali|Ling, Huiqin|Zou, Kaihe|
29 Collaborative effect between additives and current in TSV via filling process 会议论文 Huiqin, Ling|Qi, Li|Haiyong, Cao|Dali, Mao|Xianxian, Yu|Ming, Li|Kaihe, Zou|
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